Tag: Printed Circuit Board Assembly
Hendon Semiconductors wins Federal grant to modernise defence manufacturing capability
Hendon Semiconductors, a division of Legend Corporation, has secured $690,000 from the Federal Government’s Sovereign Industrial Capability Priority Grant program.
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Building resilience as manufacturing requirements become more complex
The industrial machinery and heavy equipment manufacturing sector is critical not only for its direct outputs, machines, and equipment that pave the way for construction, agriculture and manufacturing but also for its crucial role in economic development and innovation.
