EOS has announced the introduction of two new metal additive manufacturing (AM) materials designed to enhance industrial 3D printing solutions for the oil and gas and semiconductor industries.
The new materials, EOS NickelAlloy IN718 API and EOS Nickel NiCP, are tailored for high-performance applications using the company’s Laser Powder Bed Fusion (LPBF) technology, as revealed in a news release.
EOS NickelAlloy IN718 API has been developed to meet the stringent API 6ACRA standard requirements for the oil and gas sector.
The nickel-based material offers “high-impact” toughness at low temperatures and corrosion resistance in high-stress environments.
When subjected to a specific heat treatment, it achieves a tensile strength of 878 MPa and 27 per cent elongation.
The material has already been tested by a leading inflow control technology company, which produced a flow module component that met API standardization and demonstrated high-strength performance in a corrosive oil and gas environment.
An EOS customer in the inflow control sector noted that additive manufacturing has historically been a challenge for demanding downhole applications due to stringent industry requirements.
The second material, EOS Nickel NiCP, is designed for semiconductor and chemical applications requiring high nickel purity, corrosion resistance, and ductility.
With a tensile strength of 400 MPa and 49 per cent elongation, it is suitable for applications such as gas injectors and corrosion-resistant components in semiconductor capital equipment.
Traditional manufacturing in the semiconductor industry often involves electroless nickel plating to enhance corrosion resistance.
EOS Nickel NiCP enables the direct production of these parts without the need for plating, thereby extending the lifespan of consumable components.
Sophia Heyl, EOS Product Specialist, stated that the adoption of additive manufacturing with Nickel NiCP can help manufacturers improve machine uptime and throughput in wafer fabrication while also eliminating electroplating, a process that generates hazardous waste.
Dr Ankit Saharan, EOS Director of Metals Technology, highlighted the material’s successful deployment in production settings.
“By making it more broadly available, we continue to strengthen our engagement with the semiconductor industry and our dedication to advancing their applications through innovative materials and processes.”
“We look forward to working with our partners to push the boundaries of what’s possible with NiCP in additive manufacturing,” Dr Saharan noted.
