Alpha HPA has reported positive developments in its semiconductor sector marketing efforts, which are driving momentum for both stages of its HPA First Project in Gladstone, Queensland.
According to Alpha HPA’s Managing Director, Rob Williamson, the semiconductor sector remains a priority for the company’s commercial team, with growing demand linked to artificial intelligence (AI) data centre expansion and power electronics.
“Alpha’s technology is enabling our products to outperform in both the CMP slurry and thermal interface packaging applications, which is leading to the recent Letters of Intent we are seeing coming from this space,” Williamson said.
Recent testwork confirmed Alpha’s HPA materials improve Chemical Mechanical Planarization (CMP) performance, achieving over 50 per cent higher removal rates for silicon-carbide (SiC) substrates compared to existing abrasives.
The results suggest faster polishing cycles and efficiency gains for end-users, attributed to Alpha’s proprietary production process.
Following these results, Alpha has received a Letter of Intent (LOI) from a CMP sector end-user for up to 4,000 tonnes per annum of HPA, with commercial volumes expected from 2025 and larger-scale supply from 2027.
Additionally, Alpha has developed an ultra-fine HPA dispersion for high-value CMP applications, distributing samples for end-user testing.
Expanding its global marketing reach, Alpha has partnered with South Korea-based AM&M Group, specialists in semiconductor ceramics and CMP, strengthening its presence in Northeast Asia.
Alpha continues to engage with the semiconductor sector to capitalize on growing demand for its advanced HPA materials.
