Additive Manufacturing Research (AM Research) has unveiled its latest market study titled “3D Printing for Semiconductors: Market Opportunity Brief,” shedding light on the burgeoning landscape of additive manufacturing (AM) within the semiconductor industry.
The report delves into specific use cases where AM technologies can optimise and integrate into the semiconductor value chain, addressing challenges such as reduced lead times, parts consolidation, and thermal management, among others.
Furthermore, it examines the broader implications of initiatives like the CHIPs Act and geopolitical trends on AM adoption in the semiconductor industry.
Packaged as a Market Opportunity Brief, this report marks the inception of a new product series from AM Research, aimed at delivering comprehensive analysis with more content.
According to AM Research, the Market Opportunity Brief offers a condensed format (20-30 pages) while providing insights into the state and future trajectory of AM technologies in the semiconductor sector.
Accompanying the brief is an Excel file detailing various AM technologies, including Powder Bed Fusion (PBF), Directed Energy Deposition (DED), Metal Binder Jetting (MBJ), and Bound Metal Deposition (BMD).
Breakouts by material type and geography provide further granularity in understanding market dynamics.
Highlighted companies and organisations encompass a spectrum of industry players, including ASML, 3D Systems, Lam Research, Velo3D, Applied Materials, SIMTech, Fabric8Labs, Intel, Coherent, and Nikon Advanced Manufacturing.
Authored by Matt Kremenetsky, macro analyst for AM Research, the report underscores the growing significance of AM in critical sectors like energy, electronics, and defence.
For more information on the report, visit: 3D Printing for Semiconductors: Market Opportunity Brief.
